hese products require a release agent to be removed.

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4. Future trends in demolding technology
The evolution of demolding technology stems from the evolution of processes and materials. One of the notable trends is the increasing use of automation and robotics techniques for demolding. Robotic systems improve the level of precision of the ejection force, making it physically safer for parts and more time-efficient. In addition, smart sensors and IoT can help detect temperature, pressure, and mold condition in real-time. They allow the manufacturing industry to adjust demolding parameters in real-time. This approach greatly contributes to improving an individual’s control of the process and reducing defects.

In addition, the market for advanced materials for molds and release agents is expanding. For example, recent studies focus on mold surface formation using nanomaterials to eliminate release agents. In addition, bio-based and environmentally friendly release agents are increasingly recognized by manufacturers and producers. In addition to contributing to environmental preservation, these materials enhance safety in production areas.

Contemporary products are more complex in design, leading to an increasing demand for new demolding technologies. There are trends such as conformal cooling. In this technology, the cooling channels mirror the contour of the mold. This approach promotes uniform cooling. It controls part warpage, thereby improving the quality of the molded parts.

Conclusion
Demolding is one of the most important subsequent steps in injection molding. This process protects the quality of the final product, the quality of the casting mold and the uninterrupted production of subsequent castings. Demolding is the final step in the molding process. It is a process of removing a part from a mold where the material has reached a correct solidification temperature.

The main steps in the demolding process are cooling and solidifying the part, demolding, and ejection. One of the most important questions that arises in the demolding process is whether to use fan data thermoplastics or thermosets. Some thermoplastics, such as polycarbonate, can tend to stick to the mold. T

Conversely, thermoset materials such as epoxy and phenolic resin are complex to demold after curing. Distortion occurs when the cooled part loses its shape and does not conform to the final product shape. Distortion typically occurs due to uneven cooling rates or stress content in the forming system.

Part sticking, or adhesion, occurs when the part sticks to the surface of the mold cavity. This problem occurs for several reasons, such as the need for more MR, a rough mold surface, or insufficient cooling. Ejector marks are marks left on the surface of the part by the action of the ejector pin. These marks are interference marks of the ejector pins during part removal. The evolution of demolding technology stems from the evolution of processes and materials.
PTFE (Polytetrafluoroethylene) 20-30 0.5-0.7 260 2.20-2.30 Low friction, chemical inertness, excellent high temperature performance Seals, gaskets, bearings
Polycarbonate (PC) 60-70 2.1-2.4 135 1.20-1.22 High impact resistance, flame retardant, optical clarity Windows, light covers, cockpit interior components
PEEK materials for the aerospace industry
PEEK injection molded parts in the aerospace industry
Future Trends in Injection Molding in Aerospace
Injection molding for aerospace is expected to see further advancements in the future. New technologies and materials in the aerospace injection molding industry are likely to emerge to meet the growing demand. The latest trend combines additive manufacturing (AM), or 3D printing, with injection molding. These processes can integrate to build more complex geometry, optimize the part shape for minimum weight, and minimize remaining material. This technology allows for the introduction of structures such as lattices, which are virtually impossible with conventional molding methods. It improves the strength-to-weight ratio in aerospace applications.